Agilent Silicon Wafer Surface Metals Characterization by Vapor Phase Decomposition Inductively Coupled Plasma Mass Spectrometry (VPD-ICP-MS)

Update: 30 September, 2023

This application note describes a method of using ICP-MS to measure surface metal contamination on silicon wafers by combining VPD with ICP-MS.

Brand: Agilent

File format: PDF

Size: 113 KB

MD5 Checksum: BDA5A457F88F3511F47C3F398BDCC423

Publication date: 02 July, 2012

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PDF Link: Agilent Silicon Wafer Surface Metals Characterization by Vapor Phase Decomposition Inductively Coupled Plasma Mass Spectrometry (VPD-ICP-MS) PDF

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