Update: 28 September, 2023
This document describes the features of the DS34T101, DS34T102, DS34T104, and DS34T108 single/dual/quad/octal TDM-over-Packet chips from Maxim Integrated Products. These chips allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. They support multiple standards-based TDM-over-packet mapping methods and frame-based serial HDLC data flows. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.
File format: PDF
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MD5 Checksum: 0585C8F7BBD0CCBB32080384A1070B82
Publication date: 21 March, 2012
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PDF Link: MAIXM DS34T101 DS34T102 DS34T104 DS34T108 Single/Dual/Quad/Octal TDM-over-Packet Chip Manual PDF