An overview of power‑supply technologies, modules and integration trends presented in the September 2004 issue of Electronic Products China.
The document is a magazine‑style article collection from the September 2004 issue of Electronic Products China. It discusses the development of power‑supply technology, focusing on integration and packaging of power electronic components such as IGBTs, MOSFETs, rectifiers, and various power modules.
Key topics include discrete devices, power modules, intelligent power modules (IPM), TOPSwitch series, MiniSKiip modules, and integration techniques like system‑on‑chip and common substrate approaches. The text also references several manufacturers and conference papers related to high‑power IGBT modules and power‑module design. This manual is written in Chinese.