A comprehensive reference covering the fundamentals, mechanisms, and applications of lapping and polishing processes.
The Handbook of Lapping and Polishing provides an in‑depth review of the most precise surface‑finishing methods used for mechanical, electronic, and semiconductor components. It gathers contributions from experts in the United States, Japan, and Germany, covering theory, experimental systems, and practical applications.
The book includes detailed chapters on fundamentals, experimental equipment, pad properties, slurry chemistry, and process control, as well as an extensive index for quick reference.
It reviews recent developments to transform lapping and polishing into more deterministic processes.
Lapping, polishing, chemical‑mechanical polishing (CMP), and related abrasive techniques.