MITSUBISHI PM50B6LA060 user manual

Update: 28 September, 2023

The document introduces the features of the MITSUBISHI PM50B6LA060 flat-base insulated package produced in June 2005. It adopts the new 5th generation IGBT (CSTBT) chip, whose performance is improved by a 1µm fine rule process. It has over-temperature protection by detecting the Tj of the CSTBT chips and can output error signals from all the conservation upper and lower arms of the IPM. It also has a new small package, reducing the package size by 10% and thickness by 22% compared to the S-DASH series. It is suitable for photovoltaic power conditioners.


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Publication date: 22 March, 2012

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