An embodiment of a low VF trench-type Schottky diode is disclosed, comprising a diode body. The two sides of the diode body are provided with a positioning groove. The positioning groove is provided with a heat sink. The heat sink and the diode body are connected by a snap-fit. The bottom of the diode body is fixedly connected to a bonding pad. The number of bonding pads is three. The bonding pad is provided with a mounting base. The bonding pad and the mounting base are connected by a plug-in method. The present invention has the characteristics of a reasonable structure and convenient use. By setting the positioning groove and heat sink in cooperation, the heat on the diode body can be discharged in time. By setting the mounting base and bonding pad in cooperation, the mounting base and bonding pad can be assembled by the plug-in method, so that the replacement of the diode body is more convenient.