Philips Manuals (Others)

This document provides information about the dimensions of the SOT570-1 PC board. It includes soldering dimensions and solder pad information for the TFBGA180 package.

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This is a SOT579-1 PCB footprint that contains dimensions and soldering information for the product.

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This document provides information about the PC board footprint dimensions for reflow soldering of the Philips Semiconductors SOT315-1 package. It includes detailed information on the solder land, occupied area, and dimensions for the LQFP80 package.

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This file is Philips Semiconductors PC board footprint information for reflow soldering of VSO40 package

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This is a printed circuit board print pattern for SOT598-1

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SOT635-1_fp PDF file is a printed circuit board silk screen drawing released by Philips Semiconductors about SOT635-1 package. The drawing lists the details of the package dimensions, pad sizes, solder paste sizes, etc.

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This document introduces the dimensions, occupied area, and package information of SOT320-3.

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This is a PDF file about the SOT778-1 component, which mainly introduces the layout information of the component on the PCB.

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This page provides PCB footprint information for Philips SOT317-1 device.

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This document provides information about PC board dimensions for Philips Semiconductors, including the occupied area of SOT646-1 solder land and the generic footprint pattern.

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This document provides information about the PCB board soldering dimensions for the SOT307-2 package from Philips Electronics. It includes the occupied area, dimensions, and solder land information for the QFP44 package suitable for reflow soldering.

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This document is a printed circuit board printing guide that provides detailed information about the printing size and solder location of SOT754-1.

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This document is the HBCC32 SOT560-1 FOOTPRINT (REFLOW SOLDERING) datasheet

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SOT747-1_fp is a electronic component manufactured by Philips Semiconductors. The product model is SOT747-1, which is the footprint information for reflow soldering of TFBGA72 package.

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This document provides information about the PCB board layout for the SOT810-1 package, suitable for reflow soldering. It includes dimensions for solder lands, solder paste clearance, and occupied area.

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This is a file about the PCB footprint of SOT510-1, which describes its dimensions, location and soldering method in detail.

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This document is about the dimension information of the PC board footprint of SOT190-1.

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This file details the dimensions, pads, etc. of SOT360-1

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This document provides information on the PCB footprint and soldering dimensions of the SOT420-1 semiconductor device from Philips Electronics.

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