Philips Semiconductors SOT741-1 PC board footprint manual

Update: 28 September, 2023

This document is about the PCB board footprint dimensions of the SOT741-1_fp electronic component produced by Koninklijke Philips Electronics N.V. in 2004. The electronic component is a BGA376 package product suitable for reflow soldering. The document provides detailed information on the dimensions and solder pad layout of the electronic component.

File format: PDF

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MD5 Checksum: 3DC8AFC3B7179B514B22DF334377417D

Publication date: 22 March, 2012

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PDF Link: Philips Semiconductors SOT741-1 PC board footprint manual PDF

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